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Testing service

Package-level test

Sino IC provides a complete package-level testing service including the testing development, hardware design, and mass production security; we have a great deal of experience and a professional team to provide extremely excellent service for customers.



·Package form covers BGA, PGA, QFP, QFN, DIP, SOP, etc.

·Maximum 8-station finished product testing.

·Adaptive plate and interface sleeve design.

·High-low temperature test.


Our service further includes:

·Daily report

·Week report

·Yield analysis



Package-level testing equipment listCheck

For more information, please contact Business

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